Electronic Components and Technology ConferenceSWAMINATHAN, Madhavan.IEEE transactions on advanced packaging. 2000, Vol 23, Num 2, pp 131-196, issn 1521-3323Conference Proceedings

A Design Technique for Embedded Electromagnetic Band Gap Structure in Load Board ApplicationsLYNN HUH, Suzanne; SWAMINATHAN, Madhavan.IEEE transactions on electromagnetic compatibility. 2012, Vol 54, Num 2, pp 443-456, issn 0018-9375, 14 p.Article

Electrical-Thermal Co-Simulation of 3D Integrated Systems With Micro-Fluidic Cooling and Joule Heating Effects : THROUGH SILICON VIASJIANYONG XIE; SWAMINATHAN, Madhavan.IEEE transactions on components, packaging, and manufacturing technology (2011. Print). 2011, Vol 1, Num 1-2, pp 234-246, issn 2156-3950, 13 p.Article

Impact of power-supply noise on timing in high-frequency microprocessorsSAINT-LAURENT, Martin; SWAMINATHAN, Madhavan.IEEE transactions on advanced packaging. 2004, Vol 27, Num 1, pp 135-144, issn 1521-3323, 10 p.Conference Paper

IEEE Topical Meeting on Electrical Performance of Electronic PackagingDEUTSCH, Alina; SWAMINATHAN, Madhavan.IEEE transactions on advanced packaging. 1999, Vol 22, Num 3, pp 238-364, issn 1521-3323Conference Proceedings

SuperCSPKAWAHARA, T.IEEE transactions on advanced packaging. 2000, Vol 23, Num 2, pp 215-219, issn 1521-3323Conference Paper

Wafer level chip scale packaging (WL-CSP) : An overviewGARROU, P.IEEE transactions on advanced packaging. 2000, Vol 23, Num 2, pp 198-205, issn 1521-3323Conference Paper

A Novel Compact Electromagnetic Bandgap Structure in Power Plane for Wideband Noise Suppression and Low RadiationRAO, Patnam Hanumantha; SWAMINATHAN, Madhavan.IEEE transactions on electromagnetic compatibility. 2011, Vol 53, Num 4, pp 996-1004, issn 0018-9375, 9 p.Article

Preconditioned Second-Order Multi-Point Passive Model Reduction for Electromagnetic SimulationsNARAYANAN, T. V; SWAMINATHAN, Madhavan.IEEE transactions on microwave theory and techniques. 2010, Vol 58, Num 11, pp 2856-2866, issn 0018-9480, 11 p., 1Article

Simple Equivalent Circuit Model of a Stripline in Inhomogeneous Dielectric MediaBERNIE JORD YANG; SWAMINATHAN, Madhavan.IEEE microwave and wireless components letters. 2009, Vol 19, Num 12, pp 771-773, issn 1531-1309, 3 p.Article

Characterization of Co-planar silicon transmission lines with and without slow-wave effectKIM, Woopoung; SWAMINATHAN, Madhavan.IEEE transactions on advanced packaging. 2007, Vol 30, Num 3, pp 526-532, issn 1521-3323, 7 p.Article

Agilent technologies' singlemode small form factor (SFF) module incorporates micromachined silicon, automated passive alignment, and non-hermetic packaging to enable the next generation of low-cost fiber optic transceiversOWEN, M.IEEE transactions on advanced packaging. 2000, Vol 23, Num 2, pp 182-187, issn 1521-3323Conference Paper

Application of the Taguchi method to chip scale package (CSP) designMERTOL, A.IEEE transactions on advanced packaging. 2000, Vol 23, Num 2, pp 266-276, issn 1521-3323Conference Paper

Transient Chip-Package Cosimulation of Multiscale Structures Using the Laguerre-FDTD SchemeHA, Myunghyun; SRINIVASAN, Krishna; SWAMINATHAN, Madhavan et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 4, pp 816-830, issn 1521-3323, 15 p.Article

High-Q embedded passives on large panel multilayer liquid crystalline polymer-based substrateYUN, Wansuk; SUNDARAM, Venky; SWAMINATHAN, Madhavan et al.IEEE transactions on advanced packaging. 2007, Vol 30, Num 3, pp 580-591, issn 1521-3323, 12 p.Article

A model for power-supply noise injection in long interconnectsSAINT-LAURENT, Martin; SWAMINATHAN, Madhavan.IEEE international interconnect technology conference. 2004, pp 113-115, isbn 0-7803-8308-7, 1Vol, 3 p.Conference Paper

Modeling of Power Supply Noise using Efficient Macro-Model of Non-Linear DriverMUTNURY, Bhyrav; SWAMINATHAN, Madhavan; LIBOUS, James et al.IEEE International Symposium on Electromagnetic Compatibility. 2004, isbn 0-7803-8443-1, vol. 3, 988-993Conference Paper

Molecular dynamics study of thermally induced shear strain in nanoscale copperHEINO, P; RISTOLAINEN, E.IEEE transactions on advanced packaging. 1999, Vol 22, Num 3, pp 510-514, issn 1521-3323Conference Paper

Electromagnetic Modeling of Through-Silicon Via (TSV) Interconnections Using Cylindrical Modal Basis FunctionsKI JIN HAN; SWAMINATHAN, Madhavan; BANDYOPADHYAY, Tapobrata et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 4, pp 804-817, issn 1521-3323, 14 p.Article

Multilayered finite-difference method (MFDM) for modeling of package and printed circuit board planesENGIN, A. Ege; BHARATH, Krishna; SWAMINATHAN, Madhavan et al.IEEE transactions on electromagnetic compatibility. 2007, Vol 49, Num 2, pp 441-447, issn 0018-9375, 7 p.Article

Improved thermal fatigue reliability for flip chip assemblies using redistribution techniquesVANDEVELDE, B; BEYNE, E.IEEE transactions on advanced packaging. 2000, Vol 23, Num 2, pp 239-246, issn 1521-3323Conference Paper

Enhancing Signal and Power Integrity Using Double Sided Silicon InterposerSRIDHARAN, Vivek; SWAMINATHAN, Madhavan; BANDYOPADHYAY, Tapobrata et al.IEEE microwave and wireless components letters. 2011, Vol 21, Num 11, pp 598-600, issn 1531-1309, 3 p.Article

Noise Isolation in Mixed-Signal Systems Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure-Based Power Distribution Network (PDN)CHOI, Jinwoo; GOVIND, Vinu; SWAMINATHAN, Madhavan et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 1, pp 2-12, issn 1521-3323, 11 p.Article

Conformal Antennas on Liquid Crystalline Polymer Based Rigid-Flex Substrates Integrated With the Front-End ModuleALTUNYURT, Nevin; RIESKE, Ralf; SWAMINATHAN, Madhavan et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 4, pp 797-808, issn 1521-3323, 12 p.Article

Eye-Pattern Design for High-Speed Differential Links Using Extended Passive EqualizationKI JIN HAN; TAKEUCHI, Hayato; SWAMINATHAN, Madhavan et al.IEEE transactions on advanced packaging. 2008, Vol 31, Num 2, pp 246-257, issn 1521-3323, 12 p.Article